Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design.

Read the entire interview here:

https://semiwiki.com/eda/mz-technologies/333571-ceo-interview-anna-fontanelli-of-mz-technologies/

Here’s some interview highlights:

• “We’re making good progress toward achieving the objective we set eight years ago … we’ve our technology and generated revenue across Asia and Europe, so now it makes sense for us to bring our expertise to North America.”
• “We’re taking on one of the industry’s thorniest problems: Creating the technology design nexus that transforms visions of the future into tomorrow’s innovative IC reality.”
• “GENIO™ redefines the co-design of next generation heterogeneous microelectronic systems by dramatically improving the automation of integrated silicon and package EDA flows through three-dimensional interconnect optimization.” 
• “There’s nothing like GENIO today, because it was built from the ground-up.  Most of the tools that attempt to do what GENIO does are what we refer to as “bolt-ons” … capabilities are literally mashed on to another in hopes of overcoming a new set of design challenges.”
• GENIO, is built from the ground-up.  Its system optimization from a unique dedicate cockpit that supports a 3D-aware cross-hierarchical pathfinding algorithm and a rule-based methodology that delivers single-step interconnect optimization throughout the entire 3D system hierarchy.”
• “The next generation of GENIO will extend the tool’s front-end capabilities for simulation-aware system interconnect optimization and early-on system analysis.  The early-on system analysis capability will be very robust.  It will include state-of-the-art TSV models with R/C electrical performance and mechanical/thermal behavior.  It will also provide thermal modeling based on power dissipation map and TSVs contribution.”