Will highlight GENIO EVO next generation chiplet/package design tool
MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, will be exhibiting at Chiplet Summit, January 21-23, at the Santa Clara (CA) Convention Center.
MZ Technologies envisions, develops and delivers software automated solutions that facilitate the design and optimize connections in complex, heterogeneous IC systems. Highlighting the company’s presence will be the unveiling of GENIO EVO, the first integrated chiplet/package EDA tool to address in pre-layout stage the two major issues of 3D-IC design, thermal and mechanical stress.
GENIO EVO is the second generation of GENIO™, which was the EDA’s first successful integrated chiplet/package co-design tool. GENIO, MZ’s flagship product, is a cross-fabric platform for system design providing chiplet/die, silicon interposer, package, and surrounding PCB co-design features that achieve area, power, and performance targets. The tool is technology agnostic and seamlessly integrates through standard formats with all the existing commercial implementation platforms or to custom EDA flows through dedicated plug-ins.
Like the original, GENIO EVO fits into any existing design flow and operates at the architecture level, pathfinding the optimal system choices to implement a 2.5D or 3D multi-die design.
A new user interface fronts a cross-hierarchical, 3D-aware design methodology that streamlines the entire system design process. IC and advanced packaging design are integrated to ensure full system level optimization, with a shorter design cycle, faster time-to-manufacturing, and improved yields.
GENIO EVO provides additional identification and analysis of thermal and mechanical failures. It promotes architectural exploration and what-if analysis during early stages of design to improve predictability during implementation. It anticipates and avoid downstream thermal and mechanical issues by planning & managing high pin count interconnect in complex multi-fabric system design.
“Chiplet Summit is the perfect place to introduce GENIO EVO to the EDA world because it truly is the first “ground-up” design tool to tackle the complexity of chiplet/package co-design. What’s more, it’s available today for immediate licensing,” said Anna Fontanelli, founder and CEO of MZ Technologies.
