3D InCites recognizes GENIO as EDA’s Breakthrough Co-Design Tool
MZ Technology, has been named 3D InCites’ 2021 Start-up of The Year.
The 3D and heterogeneous integration technology community recognized MZ Technologies for its “innovative and much-needed design tool GENIOTM.” GENIOTM is EDA’s first commercially available IC/Packaging Co-Design Tool.
3D InCites lauded GENIOTM for considering multiple components that enable 3D co-packaging of chips and chiplets down to the PCB level. It also pointed out that GENIOTM supports the design of 2D, 2.5D, and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package, and PCB. The announcement also recognized that GENIOTM provides three different versions specifically tuned for 2.D, 2.5D and 3D design.
“We have been hearing good things about MZ Technologies and now that GENIOTM has come to market, believed it was the appropriate time to recognize their ground-breaking accomplishments by presenting them with the 3D InCites start-up of the Year Award,” said Françoise von Trapp, 3D InCites Co-Founder.
“We are humbled and honoured to have GENIOTM recognized by a forward-looking technology advocate like 3D InCites. Their membership includes some of the biggest names in the technology space and I’m grateful that they have recognized the ‘group-up’ accomplishments of our brilliant engineering team,” said Anna Fontanelli, Founder and CEO of MZ Technologies in accepting the award.
Behind GENIO’s Success
GENIO’s proprietary fully integrated design feature is an end-to-end IC and packaging platform for 2D/2.5D/3D system design. To date, the platform’s environment-agnostic feature has attracted early trial interest.
GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
GENIO’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization, she explained.
GENIO’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.
