News.

Will highlight GENIO EVO next generation chiplet/package design tool MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, will be exhibiting at Chiplet Summit,

Tackling the barriers to 3D-IC design architecture MZ Technologies has unveiled an updated technology roadmap for its GENIOTM branded integrated chiplet/packaging Co-Design EDA tool. The roadmap calls for major improvements throughout

MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools

The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer

Chip/Package Co-Design May Fulfill a Second “Moore’s Law” Gordon Moore predicted the demise of Moore’s law and envisioned in its place larger systems built from smaller, separately packaged, interconnected systems,

Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design. Read the entire interview here:

MZ Technologies’ GENIO Tool Suite adopted for Major System-in-Package IC An internationally respected System/ASIC company is adopting MZ Technologies’ GENIOTM 1.7 fully-integrated EDA co-design tool.     The company adopted a full-suite license

Demonstrate industry’s first fully integrated Toolat DATE 3D Design Workshop Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture

Know-how Critical to Project’s 3D-IC EDA Tool Set MZ Technologies, the marketing arm of Monozukuri S.p.A., today announced that it has joined Europe Horizon’s NimbleAI Research Initiative. MZ Technologies brings